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Many electronic devices, including digital cameras, incorporate image sensors. DigitalOptics Corporation™ (DOC) OptiML™ wafer-level packaging technology makes it possible to create image sensors that are thinner, more reliable and less expensive. The end result is improved device functionality and increased board capacity, enabling the next generation of smaller, smarter, faster camera-enabled electronic devices.
DOC uses the latest semiconductor manufacturing techniques to develop and deliver its OptiML micro-optic lenses, which include Diffractive Optical Elements (DOEs), Refractive Optical Elements (ROEs) and Integrated Micro-Optical Subassemblies (IMOS). These small form factor optics are available on a variety of substrates, on one or both surfaces of a wafer and in multi-wafer forms.
DOC innovative production techniques reduce labor-intensive manual assembly by replacing serial manual production with automated parallel processes. The technique is also material agnostic, which enables it to be applied to a variety of wafer substrates for a wider range of applications.
Utilizing advanced lithographic technologies, DOC fabricates its micro optical devices on a variety of substrates including fused silica, crystal quartz, Silicon and Germanium. Using wafer-level processing enables the fabrication of refractive and/or diffractive elements on one or two sides of the wafer, resulting in a high-precision, high-efficiency, cost effective products. The products are manufactured in DOC’s state-of-the-art ISO registered facility.
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