Reduce Form Factors, Cut Costs and Boost Performance with Wafer-Level Optics
 
Analysts forecast that in 2013 approximately 1.6 billion camera modules will be manufactured for cell phone applications. Manufacturers of today’s camera modules are constantly challenged to find more efficient and cost-effective ways to meet market demands for smaller devices with greater capabilities. DigitalOptics Corporation™ (DOC) OptiML™ Wafer-Level Optics technology solves these challenges by enabling manufacturers to advance the integration of miniaturized cameras in cell phones, personal computers, security cameras and other portable devices.

Based on advanced semiconductor manufacturing techniques, OptiML Wafer-Level Optics technology makes it possible to manufacture camera modules at the wafer level, reducing the size and total cost of materials while maintaining camera performance..

This innovative approach enables manufacturers to simultaneously build thousands of lenses on a single wafer. The number of lens wafers required to build the optical module is based upon the resolution and optical performance of the camera module. The lens wafers are aligned and bonded at the wafer level and diced into individual, integrated optical stacks that are mounted on top of a wafer-level packaged image sensor. The accuracy of the wafer stacking process optimizes the performance of integrated optics and packaged image sensors and eliminates the need for costly manual focusing.
 
OptiML Wafer-Level Optics technology can be used for a wide range of camera resolutions, from VGA to multi-megapixel. The technology is scalable, from a single-element CIF/VGA lens to multi-element megapixel lens structures. The tight alignment tolerances enable higher yields.
 

Benefits:
    Enables higher yield and significantly reduces costs
    Minimizes the camera form factor without sacrificing performance
    Reduces part count and cycle time
    Compatible with auto-focus and zoom
    Withstands standard solder- reflow processes
    Sustains high-temperature soldering
    Enables CCM assembly directly on the phone board DOC’s unique technologies can be customized to meet your camera-module needs.     

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